Click image to view original picture
Electronic silicone
1,heat-conducting
2,Inherent flame resistance
3,low viscosity
4,faster of the curing time
HY-9060 Electronic Potting Compound
Product Feature
HY-9060# is a kind of low viscosity, Inherent flame resistance, two components addtion cured potting silicone with heat-conducting. It cures with both on room temperature and heated temperature. It has the feature of the higher temperature the faster of the curing time. It can be applied to electronic components for insulation, waterproofing, fixed and flame retardant. The flame retardant UL94-V0 level can be achieved. It mainly applied in electronic components surface with materials of PC(Poly-carbonate),PP,ABS,PVC, etc. and metal materials.
Typical Application
HY-9060# is suitable for
- high powered electronics,
- DC/DC module and circuit board which requires heat dissipation and high temperature resistance.
It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc.
Electronic Potting Compound silicone
Technical Parameters
|
Features |
Part A |
Part B |
|
|
Before Curing |
Appearence |
Gray Fluid |
White Fluid |
|
Viscosisty(25°Ccps) |
3000±500 |
3000±500 |
|
|
Operation features |
Mixing Ratio |
1 to 1 |
|
|
Viscosisty(after mixing) (cps) |
2500~3500 |
||
|
Operating Time(25°C hr) |
120 |
||
|
Curing time (min,25°C) |
480 |
||
|
Curing time(80°C hr) |
20 |
||
|
After Curing |
Hardness(Shore A) |
60±5 |
|
|
Thermal conductivity [W(m·K)] |
≥0.8 |
||
|
Dielectric Strength(KV/mm) |
≥25 |
||
|
Permittivity(1.2MHz) |
3.0~3.3 |
||
|
Volume Resisivity(Ω·cm) |
≥1.0×1016 |
||
|
linear expansibility [m/(m·K)] |
≤2.2×10-4 |
||
|
Fire Resistance |
94-V0 |
||
